| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for improving adhesiveness between a glass substrate and an electroless-plated copper film, without sacrificing the high-frequency electroconductivity of the copper film. SOLUTION: This improving method comprises the steps of: forming the electroless-plated copper film 4 on one side of the glass substrate 1 having a flat surface, by immersing the glass substrate 1 into an electroless-copper-plating bath; and subsequently heating the electroless-plated copper film 4 by pressing a negative electrode 11 toward the glass substrate 1 side and a positive electrode 12 toward the electroless-plated copper film 4 side, and by applying voltage between the respective electrodes 11 and 12. COPYRIGHT: (C)2007,JPO&INPIT
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