| 摘要 |
A semiconductor device including: a semiconductor substrate (10) on which a plurality of electrodes (14) are formed; a plurality of resin protrusions (20) formed on the semiconductor substrate (10), arranged along a straight line, and extending in a direction which intersects the straight line; and a plurality of electrical connection sections (30) formed on the resin protrusions (20) and electrically connected to the electrodes (14). |
