发明名称 MANUFACTURING METHOD OF OPTICAL DEVICE TO WHICH TRANSPARENT COVER IS ATTACHED AND MANUFACTURING METHOD OF OPTICAL DEVICE MODULE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical device and a manufacturing method of an optical device module using the same. <P>SOLUTION: This manufacturing method of an optical device comprises: preparing a semiconductor substrate equipped with a plurality of dies comprising an effective pixel and a plurality of bonding pads arranged around the effective pixel; forming a protective film on a semiconductor substrate for selectively covering the effective pixel; forming an adhering pattern surrounding a terminal part of the effective pixel; and attaching a transparent cover to the substrate through the adhering pattern corresponding to the effective pixel. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007027713(A) 申请公布日期 2007.02.01
申请号 JP20060185737 申请日期 2006.07.05
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KANG SUK-CHAE;KWON YONG-CHAI;KWON YONG-HWAN;KIM GU-SUNG;HEO SUN-WOOK
分类号 H01L27/14;H04N5/335;H04N5/369;H04N5/374 主分类号 H01L27/14
代理机构 代理人
主权项
地址