发明名称 |
MANUFACTURING METHOD OF OPTICAL DEVICE TO WHICH TRANSPARENT COVER IS ATTACHED AND MANUFACTURING METHOD OF OPTICAL DEVICE MODULE USING THE SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical device and a manufacturing method of an optical device module using the same. <P>SOLUTION: This manufacturing method of an optical device comprises: preparing a semiconductor substrate equipped with a plurality of dies comprising an effective pixel and a plurality of bonding pads arranged around the effective pixel; forming a protective film on a semiconductor substrate for selectively covering the effective pixel; forming an adhering pattern surrounding a terminal part of the effective pixel; and attaching a transparent cover to the substrate through the adhering pattern corresponding to the effective pixel. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
申请公布号 |
JP2007027713(A) |
申请公布日期 |
2007.02.01 |
申请号 |
JP20060185737 |
申请日期 |
2006.07.05 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KANG SUK-CHAE;KWON YONG-CHAI;KWON YONG-HWAN;KIM GU-SUNG;HEO SUN-WOOK |
分类号 |
H01L27/14;H04N5/335;H04N5/369;H04N5/374 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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