| 摘要 |
A sputter target, where the sputter target is comprised of cobalt (Co), platinum (Pt), a single-component oxide or a multi-component oxide, and an elemental metal additive. The elemental metal additive has a reduction potential of greater than -0.03 electron volts, and is substantially insoluble with cobalt (Co) at room temperature. The elemental metal additive is copper (Cu), silver (Ag), or gold (Au), and the sputter target is further comprised of chromium (Cr) and/or boron (B). The sputter target is comprised of between 2 atomic % and 10 atomic % copper (Cu), silver (Ag), or gold (Au) or other elemental metal additive. Accordingly, the enhanced sputter target provides significant improvements in thermal stability and SNR, through enhancements to magnetocrystalline anisotropy and increased grain-to-grain segregation.
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