发明名称 |
Composite metal column for mounting semiconductor device |
摘要 |
An integrated circuit chip which has a plurality of pads and non-reflowable contact members to be connected by reflow attachment to external parts. Each of these contact members has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermo-mechanical stress. The members have a solderable surface on each end and a layer of reflowable material on each end. Each member is solder-attached at one end to a chip contact pad, while the other end of each member is operable for reflow attachment to external parts.
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申请公布号 |
US2007018304(A1) |
申请公布日期 |
2007.01.25 |
申请号 |
US20060470541 |
申请日期 |
2006.09.06 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
TELLKAMP JOHN P.;MATSUNAMI AKIRA |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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