发明名称 THIN PRINTED CIRCUIT BOARD USING STIFFENER AND MANUFACTURING METHOD THEREOF
摘要 A thin printed circuit board using a stiffener and a fabrication method thereof are provided to prevent the bending of the board by attaching the stiffener on the board. In a thin printed circuit board, a core substrate(11) has a circuit in an inner layer or an outer layer. An electronic component is attached to a top plane or a bottom plane of the core substrate. A stiffener(20) is attached to the side of the core substrate, and prevents the bending of the core substrate. The electronic component is an integrated circuit chip(12) or a passive device component(13).
申请公布号 KR100671748(B1) 申请公布日期 2007.01.22
申请号 KR20050091466 申请日期 2005.09.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KO, KYUNG HWAN;CHO, SOON JIN
分类号 H05K1/02 主分类号 H05K1/02
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