发明名称 |
THIN PRINTED CIRCUIT BOARD USING STIFFENER AND MANUFACTURING METHOD THEREOF |
摘要 |
A thin printed circuit board using a stiffener and a fabrication method thereof are provided to prevent the bending of the board by attaching the stiffener on the board. In a thin printed circuit board, a core substrate(11) has a circuit in an inner layer or an outer layer. An electronic component is attached to a top plane or a bottom plane of the core substrate. A stiffener(20) is attached to the side of the core substrate, and prevents the bending of the core substrate. The electronic component is an integrated circuit chip(12) or a passive device component(13).
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申请公布号 |
KR100671748(B1) |
申请公布日期 |
2007.01.22 |
申请号 |
KR20050091466 |
申请日期 |
2005.09.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KO, KYUNG HWAN;CHO, SOON JIN |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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