| 摘要 |
An electrostatic chuck of a semiconductor etching apparatus is provided to avoid the delay of work caused by replacement of an electrostatic chuck by incorporating a chuck body and a water jacket so that an additional separation process is unnecessary in replacing the electrostatic chuck. A wafer is placed on a chuck body(110) in an electrostatic chuck of a semiconductor etching apparatus. A water jacket(120) is coupled to the lower part of the chuck body to cool the chuck body, surrounding the lower part of the chuck body. The chuck body and the water jacket are incorporated.
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