| 摘要 |
An electronic package having a patterned layer on the back side of a substrate is provided to form a backside layer on a substrate of a photo-definable polymer material such that the backside layer is patterned to be a thickness of around 4~20 micrometers by using a developing technique for spin coating and patterning. A substrate(100) has front and back surfaces confronting each other, made of a substantially transparent material with respect to light having wavelength in a predetermined scope. At least one photo-sensing semiconductor die(200) is coupled to the substrate, receiving the light impinging the back surface and defining at least one photo-sensing region(150) confronting the front surface of the substrate to make the received light pass through the substrate. A patterned layer(130) is formed on the back surface of the substrate to block the passing of at least a part of the light impinging the back surface, defining a window opening(132) aligned with at least a part of the photo-sensing region to obtain an optical communication through the substrate. The window opening is of a rectangular type, disposed in the periphery of the photo-sensing region. The patterned layer is made of an absorbable material with respect to light with a predetermined scope of wavelength. |
