| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated electronic component which can reduce a manufacturing cost by decreasing the number of necessary laminate preparing steps. SOLUTION: Four sides of an outer periphery of an upper surface of a green sheet each have 4 positioning marks Mx1-Mx4, My1-My4, one type of second green sheets GS2 having an equal conductor IEL formation array is used, and the second green sheets are stacked so that the even-numbered second green sheet GS2 is stacked on the odd-numbered second green sheet GS2 so as to be shifted by a predetermined distance in their diagonal direction. A plurality of upper-side first green sheets GS1 are stacked so that the positioning marks Mx1-Mx4, My1-My4 present in 2 of the 4 sides of the uppermost second green sheet GS2 and the positioning marks Mx1-Mx4, My1-My4 present in 2 of the 4 sides of the second green sheet GS2 located second from the top and different from the first-mentioned 2 sides are exposed when viewed from the top. COPYRIGHT: (C)2007,JPO&INPIT
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