HEAT SINK WITH MICROCHANNEL COOLING FOR POWER DEVICES

摘要

An apparatus for cooling at least two heated surfaces includes a base plate defining multiple upper and lower supply manifolds and upper and lower exhaust manifolds. The upper and lower supply (exhaust) manifolds receive (exhaust) coolant, and the upper (lower) supply and exhaust manifolds are interleaved. The apparatus further includes an upper substrate having an inner surface and an outer surface. The inner surface is coupled to the base plate and defines multiple microchannels for receiving and exhausting coolant. The outer surface is in thermal contact with one of the heated surfaces. The apparatus further includes a lower substrate having an inner surface and an outer surface. The inner surface is coupled to the base plate and defines multiple microchannels for receiving and delivering coolant. The outer surface is in thermal contact with another of the heated surfaces. The apparatus further includes a supply plenum and an exhaust plenum oriented in a plane of the base plate.