发明名称 SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor apparatus capable of suppressing the occurrence of a stress, even if electrical conductor flows from the central part toward the periphery of an electric conductor pad. SOLUTION: The semiconductor apparatus comprises an insulating film 10, located above a semiconductor device, the electrical conductor pad 11, formed on the insulating film 10, and a first opening pattern 12 formed in the electrical conductor pad 11. Thus, even if the electrical conductor forming the electric conductor pad 11 flows, the fluidity of the electrical conductor is absorbed by the opening pattern 12. When the conductor pad 11 has a nearly polygonal shape, the first opening pattern 12 is preferably formed in the vicinity of each corner of the conductor pad 11. In this case, the first opening pattern 12 may have a nearly L-shaped slit, arranged along two sides forming the corner. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006339408(A) 申请公布日期 2006.12.14
申请号 JP20050162325 申请日期 2005.06.02
申请人 SEIKO EPSON CORP 发明人 SHINDO AKINORI
分类号 H01L23/52;H01L21/3205 主分类号 H01L23/52
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