发明名称 PERFORATED FILM AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a perforated film having through-holes with a predetermined hole size present therein in arbitrary density. SOLUTION: In the perforated film wherein fine through-holes are formed to a thermoplastic synthetic resin film at a predetermined pitch, the ratio of the average hole size/average pitch of the fine through-holes is 0.15-0.85 and the thickness of the film is 1-25μm. A large number of fine recessed parts are formed to the thermoplastic synthetic resin film by emboss processing using an embossing body having a large number of fine protrusions and heat treatment is applied to the thermoplastic synthetic resin film, which is subjected to emboss processing, at a temperature lower than the melting temperature of the thermoplastic synthetic resin film but higher than the glass transition temperature thereof to form the through-holes to the recessed parts. By this method, the thermoplastic synthetic resin film with a thickness of 1-25μm having the fine through-holes substantially regularly arranged thereto is obtained. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006326860(A) 申请公布日期 2006.12.07
申请号 JP20050149418 申请日期 2005.05.23
申请人 ASIA GENSHI KK 发明人 HAYASHI KAZUJI;HORI YOSHIAKI
分类号 B29C67/20;B29C59/04;B29K105/04;B29L7/00;C08J9/00 主分类号 B29C67/20
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