摘要 |
PROBLEM TO BE SOLVED: To prevent resin that composes a mold part from separating from a circuit board by mechanical vibration transmitted from an external part, in an electronic circuit unit having a structure covered with the mold part, by mounting a constituting part of an electronic circuit on the circuit board. SOLUTION: A connector 1 and its other constituting part 2 or 6 are mounted on the circuit board 7, and the mold part 8 composed of an insulating resin is formed so as to cover a part of the connector 1, the constituting part 2 or 6 and the circuit board 7. A plurality of through-holes 701 are formed in the circuit board 7, and the resin of the mold part for respectively covering the surface side and both reverse sides of the circuit board, is mutually connected by resin filled inside the plurality of respective through-holes 701. COPYRIGHT: (C)2007,JPO&INPIT
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