| 摘要 |
The present invention provides a system ( 100 ) for conditioning multi-component slurries utilized in chemical mechanical polishing (CMP) of semiconductor wafers ( 140 ). The system provides a first slurry component ( 108 ), and a second slurry component ( 120 ). A conditioning component ( 102 ) has first and second inlets, and an outlet operatively coupled to a dispensing system ( 138 ). First and second flow control components ( 116, 126 ) are operably intercoupled between the first and second inlets and the first and second slurry components, respectively. The system further provides a megasonic energy source ( 106 ), adapted to generate an energy field ( 118 ) across the conditioning component. A conveyance component ( 114 ) conducts the slurry components from the inlets through the energy field, and delivers a final mixture ( 136 ) of multi-component slurry to the outlet.
|
