发明名称 COMBINATION OF FAN AND HEATSINK
摘要 PROBLEM TO BE SOLVED: To provide a combination of a fan and a heatsink, which can satisfy heat dissipation requirements for components or elements included in an electronic system. SOLUTION: A fan and heatsink combination (108), which is a combination of a fan (118) and a heatsink (120) for transferring heat from a heat source, comprises: a base for conducting heat from the heat source; the fan (118) mounted on top of the base; and multiple heat dissipation fins (122) that spread around the fan (118) and extend from the base to a location beyond the surface of the fan (118). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006319334(A) 申请公布日期 2006.11.24
申请号 JP20060130068 申请日期 2006.05.09
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 BELADY CHRISTIAN L
分类号 H01L23/467;H01L23/36;H05K7/20 主分类号 H01L23/467
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