摘要 |
PROBLEM TO BE SOLVED: To provide a combination of a fan and a heatsink, which can satisfy heat dissipation requirements for components or elements included in an electronic system. SOLUTION: A fan and heatsink combination (108), which is a combination of a fan (118) and a heatsink (120) for transferring heat from a heat source, comprises: a base for conducting heat from the heat source; the fan (118) mounted on top of the base; and multiple heat dissipation fins (122) that spread around the fan (118) and extend from the base to a location beyond the surface of the fan (118). COPYRIGHT: (C)2007,JPO&INPIT |