Elektrisches Kontaktierungsverfahren

摘要

The method involves producing the conducting tracks (5) of the circuit board (1) in a layout on a former in which the tracks are extended beyond a separation line that defines the edge that will later face the MID component (10), providing through bores (6d) along the separating line at least in the track region, electrically through-contacting (6e) the bores, separating the circuit boards from the former and positioning each circuit board to be contacted relative to the MID component and soldering adjacent tracks together. An independent claim is also included for the following: (a) a method of manufacturing more than one circuit board.