发明名称 Method of developing an electronic module
摘要 An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboard, a multichip module (MCM) mounted to the motherboard, and a circuit unit connected to the MCM. The circuit unit comprises a flexible substrate, instrumentation circuitry mounted on the flexible substrate, and a connector coupled to the flexible substrate. The flexible substrate has signal lines that electrically communicate with the MCM, the instrumentation circuitry, and the connector. A portion of the flexible substrate is located between the MCM and the motherboard and permits electrical communication therebetween. The instrumentation circuitry does not occupy space on the motherboard.
申请公布号 US7134194(B2) 申请公布日期 2006.11.14
申请号 US20030707004 申请日期 2003.11.13
申请人 DELPHI TECHNOLOGIES, INC. 发明人 BRANDENBURG SCOTT D.;OMAN TODD P.;MILLER MICHEAL E.
分类号 H05K3/30;H05K1/14;H05K1/18;H05K3/28;H05K3/34;H05K3/36;H05K7/14 主分类号 H05K3/30
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