摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-shrinkable film provided with an IC tag inlet capable of easily mounting the IC tag inlet to a commodity main body or a package of a commodity, and the commodity using the same. <P>SOLUTION: In this shrink film with an IC tag, a pressure-sensitive adhesive layer 2 is provided on the back of a heat-shrinkable film layer 1 composed of a uniaxially or biaxially stretched film punched into a small piece shape and the IC tag inlet 3 is attached or arranged to the heat-shrinkable film layer 1 through the pressure-sensitive adhesive layer 2 or attached and arranged between the heat-shrinkable film layer 1 and the pressure-sensitive adhesive layer 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |