发明名称 SHRINK FILM WITH NON-CONTACT TYPE IC TAG AND ARTICLE WITH NON-CONTACT TYPE IC TAG
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat-shrinkable film provided with an IC tag inlet capable of easily mounting the IC tag inlet to a commodity main body or a package of a commodity, and the commodity using the same. <P>SOLUTION: In this shrink film with an IC tag, a pressure-sensitive adhesive layer 2 is provided on the back of a heat-shrinkable film layer 1 composed of a uniaxially or biaxially stretched film punched into a small piece shape and the IC tag inlet 3 is attached or arranged to the heat-shrinkable film layer 1 through the pressure-sensitive adhesive layer 2 or attached and arranged between the heat-shrinkable film layer 1 and the pressure-sensitive adhesive layer 2. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006305860(A) 申请公布日期 2006.11.09
申请号 JP20050131167 申请日期 2005.04.28
申请人 TOPPAN LABEL CO LTD 发明人 TAKESHIMA AKIRA
分类号 B32B27/00;B42D15/10;B65B53/00;B65D25/20;B65D41/62;B65D51/24;B65D65/40;B65D75/54;G06K19/00;G06K19/07;G09F3/00;G09F3/04 主分类号 B32B27/00
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