| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and method for a semiconductor device allowing considerable reduction in connection failure between a wiring electrode of the circuit mounting substrate for subjecting a semiconductor element to flip mounting and a metal bump formed in the electrode pad of the semiconductor element. <P>SOLUTION: The manufacturing apparatus for a semiconductor device includes a machining means for forming a recess 10 on a wiring electrode 2 of a circuit mounting substrate 1 for subjecting a semiconductor element to flip mounting, and includes an applying means for applying a conductive bonding agent to the recess. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
