| 摘要 |
Disclosed herein is a semiconductor wafer polishing apparatus having a magneto-rheological elastic pad, in which the dielectric layer of the wafer fixed in the wafer holder to contact the abrasive coated on a rotating plate is polished. The semiconductor wafer polishing apparatus comprises a magneto-rheological elastic pad formed by a plurality of segments received to be fixed on the rotating plate; a plurality of electromagnets, having equal or larger diameter than that of wafer to selectively pressurize a part or the entire area of the wafer, which is arranged at the lower portion of the rotating plate in such a way that the central part accords with the central axis of the wafer holder; and a controller for selectively generating the magnetic field at a part or the entire part of the electromagnets.
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