发明名称 FLIP-CHIP NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a bright nitride light-emitting element which has a light-transmitting conductive oxide layer that is incorporated into the element to maximize a reflection effect of a reflective ohmic contact layer structure, thus offering high brightness in light emission. <P>SOLUTION: The flip-chip nitride semiconductor light-emitting element 20 comprises n-type/p-type nitride semiconductor layers 24, 26, and an active layer 25 formed between the semiconductor layers 24, 26. The light-emitting element 20 also includes an ohmic contact layer 27a formed on the p-type nitride semiconductor layers 26, a light-transmitting conductive oxide layer 27b formed on the ohmic contact layer 27a, and a high-reflective metal layer 27c formed on the light-transmitting conductive oxide layer 27b. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006303430(A) 申请公布日期 2006.11.02
申请号 JP20050379216 申请日期 2005.12.28
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 SAI SHOKAN;IN SHAKUKICHI;KO KUN YOO;SHIN HYUN WOOK;YI BONG IL
分类号 H01L33/10;H01L33/32;H01L33/42;H01L33/62 主分类号 H01L33/10
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