发明名称 METAL FOIL CONNECTION AND SOLDER GRAIN FRACTION FOR METAL FOIL CONNECTION
摘要 <p>A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.</p>
申请公布号 EP1146985(B1) 申请公布日期 2006.11.02
申请号 EP20000901087 申请日期 2000.01.11
申请人 EMITEC GESELLSCHAFT FUER EMISSIONSTECHNOLOGIE MBH 发明人 WIERES, LUDWIG;KURTH, FERDI;SCHLOTMANN, HELGE
分类号 B23K1/00;B23K3/06;B23K35/14;B23K101/02 主分类号 B23K1/00
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