| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device exhibiting excellent packaging properties in which electric characteristics can be inspected easily. SOLUTION: The semiconductor device comprises a semiconductor substrate 10 having a plurality of electrode pads 14 arranged along a line 15, and a bump formed on the semiconductor substrate 10 and having a proximal end 22 and a protrusion 24 protruding therefrom. The protrusion 24 has a center located at a position shifted from the line 15. Protrusions 24 of two adjacent bumps 20 are arranged on the opposite sides of the line 15 while being shifted. COPYRIGHT: (C)2007,JPO&INPIT
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