发明名称 Heat dissipation device for multiple heat-generating components
摘要 A heat dissipation device includes a first heat sink ( 10 ), a second heat sink ( 20 ) and four heat pipes ( 30 ) thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins ( 14 ) and the second heat sink comprises a plurality of second heat dissipation fins ( 24 ). Each heat pipe comprises an evaporating portion ( 32 ) and a condensing portion ( 34 ). The evaporating portions of two heat pipes thermally engage in a base of the first heat sink and the condensing portions thereof connect the first and second heat dissipation fins. The evaporating portions of the other two heat pipes thermally engage in a base of the second heat sink and the condensing portions thereof connect the second and first heat dissipation fins.
申请公布号 US2006238982(A1) 申请公布日期 2006.10.26
申请号 US20050266044 申请日期 2005.11.03
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 LEE HSIEH-KUN;XIA WAN-LIN;LI TAO;XIAO MIN-QI
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址