| 摘要 |
PROBLEM TO BE SOLVED: To improve the soldering quality of a chip type capacitor. SOLUTION: The chip type capacitor comprises a capacitor main body 2 and an insulating plate 7 disposed on the lead-wire deriving end-surface of the capacitor main body 2, and has electrodes 10, 10 for connecting the capacitor with a substrate which are formed by folding in parallel with the insulating plate 7 lead wires passed through the insulating plate 7. With respect to the capacitor, cut grooves 11 are formed on the insulating plate 7 and in the peripheries of the electrodes 10, 10 for connecting the capacitor with the substrate. Even though the heat applied to the electrodes 10, 10 for connecting the capacitor with the substrate is transferred to the insulating plate 7, it is so interrupted by the air gaps formed by the cut grooves 11 as to prevent it from diffusing into the whole of the insulating plate 7 and as to perform surely the soldering of the capacitor. COPYRIGHT: (C)2007,JPO&INPIT
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