| 摘要 |
A power electronic package includes first and second high thermal conductivity insulating non-planar substrates 1, 2; and a plurality of electronic components 20, 30 mounted on each of the substrates 1, 2. The substrates 1, 2 are coupled to each other at a plurality of bonding regions so that mechanical separation between the substrates 1, 2 is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions. The mechanical separation provides a net axially-directed compressive force in the electronic components 20, 30. |
