THERMOSETTING RESIN COMPOSITION FOR MOUNTING ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for mounting an electronic part, having high reliability of junction between an electrode of the electronic part and an electrode on a circuit board, and capable of connecting the electrode of the electronic part with the circuit board at a low cost while securing the reliability of isolation between neighboring electrodes. SOLUTION: A thermosetting resin composition having at least two or more exothermal peaks within the temperature ranging from 373K to 523K in differential scanning calorimetry at 10K/min continuous temperature-raising scanning rate, and 0.5-100 Pa s viscosity at 298K temperature of the uncured resin composition is used as the thermosetting resin composition for mounting the electronic part. COPYRIGHT: (C)2006,JPO&NCIPI