| 摘要 |
An anti-vibration platform for supporting a semiconductor equipment is constructed from a plurality of top and bottom ball couplings having threaded holes provided thereon, a plurality of rigid connecting bars separately horizontally or diagonally connected at two externally threaded free ends to two of the ball couplings, and a plurality of vertical supports separately connected at two externally threaded free ends to two vertically corresponding ball couplings. Steel plates are provided at a bottom and four sides of the platform, and threaded bars are provided to extend through the side steel plates to connect the platform to a concrete foundation. Anti-vibration and pressure-resistant elastomeric material is applied to the bottom of the platform to wrap joints of the bottom ball couplings, the connecting bars, and the vertical supports. A flat bed is positioned to a top of the platform by screwing to the top ball couplings.
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