| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for a resin-sealed semiconductor device, which is capable of improving a semiconductor device package in the space factor of a chip so as to cope with the reduction in the size of a semiconductor device and to reduce the mounting area of the semiconductor device on a circuit board or improve the circuit board in mounting density and to provide a lead frame for the resin-sealed semiconductor device, which enables a small package such as a conventional TSOP to be hard to have a large number of pins to have a large number of pins. SOLUTION: This lead frame for the resin-sealed semiconductor device is equipped with internal terminals for being electrically connected to the terminals of a semiconductor elements, external terminals for being electrically connected to an external circuit, and connection leads which connect the internal terminals to the external terminals together. The internal terminal, the external terminal, and the connection lead are formed in one piece, the external terminals are made to protrude from the lead frame in a certain direction perpendicular to the surface of the lead frame through the intermediary of the connection lead, the pairs of the internal terminals whose opposed tips are connected together through the intermediary of the connection leads are provided in a multi-stage manner and connected to the connection lead outside of the external terminals, and an external frame unit which holds them in one piece as a whole is provided. COPYRIGHT: (C)2003,JPO |
