| 摘要 |
<P>PROBLEM TO BE SOLVED: To compact the whole shape of a power semiconductor device having attached cooling fins thereto. <P>SOLUTION: There is provided the power semiconductor device having two cooling fins and having at least two power modules, each of which has a mold surface molded by a resin on its first principal surface and has a heat radiating surface on its second principal surface present in the rear of its first principal surface. In the power semiconductor device, the power modules are so disposed as to use the two paired ones as a unit, and in the paired two power modules, their mold surfaces are so disposed oppositely to each other as to contact pressingly with the respective heat sinks of the cooling fins their respective heat radiating surfaces oriented to the reverse externals by the paired disposals of the two power modules, and as to sandwich the plurality of power modules between the two cooling fins. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
