OXYGEN-DOPED FIRING OF BARIUM TITANATE ON COPPER FOIL

摘要

PROBLEM TO BE SOLVED: To provide a process which markedly reduces the reduction potential in a dielectric without oxidation of copper foil. SOLUTION: The present invention relates to a method for preparing an embedded capacitor and a printed wiring board, and the method includes processes of providing a metal foil; forming a first dielectric layer by covering the metal foil; forming a conductive layer by covering at least a part of the first dielectric layer; controlling an amount of contained oxygen in a controlled atmosphere; and firing the first dielectric layer and the conductive layer in a firing region in a controlled atmosphere. COPYRIGHT: (C)2006,JPO&NCIPI