发明名称 CONSTITUENT FOR IMPEDANCE MATCHING
摘要 PROBLEM TO BE SOLVED: To provide a constituent constituent that enables bias impedance matching with a high precision. SOLUTION: This constituent 100 is inserted into the hole of a multi-layered board to enable impedance matching in the board. The constituent 100 comprises a conductive ground core 102 penetrating and extending multiple layers, a dielectric layer 104 laterally surrounding the conductive ground core 102, and a signal conductive layer 106 laterally connected to the dielectric layer 104. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006191018(A) 申请公布日期 2006.07.20
申请号 JP20050357348 申请日期 2005.12.12
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 CHHEDA SACHIN NAVIN;YATES KIRK;BHAGWATH NITIN C
分类号 H05K3/46;H05K1/11 主分类号 H05K3/46
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