| 摘要 |
A system of mounting a heat sink to a processor in a console is provided. The processor is mounted on a first side of a PCB and the heat sink is mounted to the first side of the PCB so as to be in contact with the processor. A plurality of studs are mounted to the heat sink and extend through passageways in the PCB. A spring element is mounted to the studs on the second side of the PCB. A thrust plate is mounted to the spring element so that the spring element can press the thrust plate against the second side of the PCB. The spring element thus provides a force that aids in ensuring the heat sink and the processor are in tight contact. The studs can be attached to a housing via fasteners so the housing supports the heat sink rather than the PCB.
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