| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high precision and high density multilayer wiring board, electronic device, and electronic equipment. <P>SOLUTION: The multilayer wiring board has at least two-layered wiring layers, an interlayer dielectric disposed between the wiring layers, and conductor posts for having continuity between the wiring layers; and the conductor post is of a truncated cone shape with 1 micrometer to 20 micrometers in thickness and 10 micrometers to 200 micrometers in diameter. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
