发明名称 Substrate processing apparatus, method of controlling substrate, and exposure apparatus
摘要 A load-lock apparatus including a load-lock chamber, a chuck, arranged in the load-lock chamber, to hold a substrate, a pressure reduction system to reduce a pressure in the load-lock chamber using an exhaust valve, a pressure measurement system to measure a pressure in the load-lock chamber, and a time measurement system to measure an operating time of the pressure reduction system. The exhaust valve is controlled such that a relationship between a pressure measured by the pressure measurement system and a time measured by the time measurement system falls within a predetermined range with respect to a predetermined relationship.
申请公布号 US2006142890(A1) 申请公布日期 2006.06.29
申请号 US20060363046 申请日期 2006.02.28
申请人 CANON KABUSHIKI KAISHA 发明人 EDO RYO
分类号 G03F7/20;H01L21/00;H01L21/027;H01L21/677;H01L21/683 主分类号 G03F7/20
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