| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which is downsized and can perform a test of electric signal between semiconductor apparatuses as a stack structure, in relation to a semiconductor apparatus whose testing terminal is formed on a substrate on which a semiconductor chip is mounted. <P>SOLUTION: A mounting terminal 92 connected with another semiconductor apparatus is formed on one side of a substrate 81, and a testing terminal 103 is formed on the substrate 81 of the side opposite to the side on which the mounting terminal 92 is located. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
