| 摘要 |
PROBLEM TO BE SOLVED: To provide a suitable conductive pad eliminating a conductive failure caused by the peeling or connection failure of a lead wire caused by the bonding failure of the lead wire and the conductive pad when bonding the lead wire on the conductive pad using adhesive paste in a connecting terminal, and to provide its manufacturing method. SOLUTION: With the adhesive paste on the conductive pad 2, the lead wire 3 is bonded in a terrace-like structure of several steps which do not have depressions at lower steps in boundaries of upper steps and the lower steps and first adhesive paste is applied to a lead-wire connection part at least once or more, and heated and dried. Then, second adhesive paste is applied on the heated/dried adhesive paste, the end of the lead-wire is bonded to the second adhesive paste. Thus the manufacturing method for the conductive pad baked after heating and drying is obtained. COPYRIGHT: (C)2006,JPO&NCIPI
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