发明名称 |
Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip |
摘要 |
Packaged integrated circuit devices include a package substrate and a multi-chip stack of integrated circuit devices on the package substrate. The multi-chip stack includes at least one chip-select rerouting conductor. This rerouting conductor extends from the package substrate to a chip pad on an upper one of the chips in the multi-chip stack. The chip-select rerouting conductor extends through a first via hole in a lower one of the chips in the multi-chip stack.
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申请公布号 |
US2006118972(A1) |
申请公布日期 |
2006.06.08 |
申请号 |
US20060339973 |
申请日期 |
2006.01.26 |
申请人 |
BAEK SEUNG-DUK;LEE IN-YOUNG;SIM SUNG-MIN;JANG DONG-HYEON;CHUNG HYUN-SOO;SONG YOUNG-HEE;PARK MYEONG-SOON |
发明人 |
BAEK SEUNG-DUK;LEE IN-YOUNG;SIM SUNG-MIN;JANG DONG-HYEON;CHUNG HYUN-SOO;SONG YOUNG-HEE;PARK MYEONG-SOON |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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