MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed is a multilayer wiring board having high degree of freedom in wiring design wherein high-density wiring is possible. Also disclosed is a method for easily manufacturing such a multilayer wiring board. Specifically disclosed is a multilayer wiring board comprising two or more layers of wiring arranged on a core substrate via an electrical insulation layer. The core substrate has a plurality of through holes which are filled with a conductive material and electrically connected between the front and rear ends. The through holes respectively have an opening diameter of 10-100 µm, and are provided with an insulating film and a conductive material diffusion-preventing layer. The conductive material is filled into the through holes via the insulating films. The first layer of wiring formed on the core substrate via the electrical insulation layer is connected with the conductive material filled in the through holes through a via.