发明名称 |
A plated copper alloy material and process for production thereof |
摘要 |
<p>A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 mu m. The copper-tin alloy layer has a thickness of 0.1-1.0 mu m and contains 35-75 at% of copper. The material may additionally have a tin layer no thicker than 0.5 mu m for an engaging type terminal containing 0.001-0.1 mass% of carbon, or thicker than 0.5 mu m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.</p> |
申请公布号 |
EP1281789(B1) |
申请公布日期 |
2006.05.31 |
申请号 |
EP20020017151 |
申请日期 |
2002.07.30 |
申请人 |
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) |
发明人 |
HARA, TOSHIHISA;SHINTANI, YASUHIRO;NISHIMURA, MASAYASU;OZAKI, RYOICHI;KAWAGUCHI, MASAHIRO |
分类号 |
C23C28/02;C23C26/00;C25D5/12;H05K3/24 |
主分类号 |
C23C28/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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