| 发明名称 |
POWER SEMICONDUCTOR MODULE |
| 摘要 |
A power module that includes a molded shell having a lead frame molded in a mold body, and a plurality of power semiconductor devices disposed directly on the die pads of the lead frame. |
| 申请公布号 |
EP1654761(A2) |
申请公布日期 |
2006.05.10 |
| 申请号 |
EP20040781246 |
申请日期 |
2004.08.16 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
FISSORE, SERGIO;GRANT, WILLIAM |
| 分类号 |
H01L23/495;H01L23/34;H01L23/498;H01L25/07;H05K3/20 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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