发明名称 HALF CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a half cutting device capable of constantly setting a fixed cut depth corresponding to variations in thickness of an adhesive body 1 by regulating the cut depth of a cutting blade 12 to the sheet-like adhesive body 1 with a simple structure. SOLUTION: The half cutting device cuts and removes an adhesive layer and a base material layer in a state of leaving a peelable support by relatively moving the cutting blade 12 to the sheet-like adhesive body 1, which is formed by laminating the adhesive layer 1b and the base material layer 1c on the peelable support 1a in that order, after supporting a cutter holder 11 for holding the cutting blade 12 with a device body. A protrusion amount of the cutting blade 12 from the tip of the cutter 25 holder 11 can be adjusted. An adjusting means 23 for adjusting the protrusion amount of the cutting blade 12 is provided to the device. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006110651(A) 申请公布日期 2006.04.27
申请号 JP20040298106 申请日期 2004.10.12
申请人 MAX CO LTD 发明人 SEKINE HIROYUKI;ANAZAWA YOSHIKATA
分类号 B26D7/26;B26D1/04 主分类号 B26D7/26
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