SEMICONDUCTOR WAFER MATERIAL REMOVAL APPARATUS AND METHOD FOR OPERATING THE SAME

摘要

A system for applying a microtopography to a semiconductor wafer (205) is provided. The system includes a chuck (201) configured to hold and rotate the wafer (205). The system also includes a grinding wheel (211) disposed over the chuck (201) in a proximately adjustable manner relative to the wafer (205) to be held by the chuck (201). The grinding wheel (211) is configured to rotate about a central axis of the chuck. The grinding wheel (211) is capable of contacting the wafer (205) and removing material from the wafer (205) at the area of contact. Appropriate application of the grinding wheel (211) to the wafer (205) serves to generate a microtopography across the wafer surface. The resulting microtopography can then be planarized more effectively by conventional chemical mechanical planarization methods.