EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, NEW PHENOLIC RESIN, NEW EPOXY RESIN, METHOD FOR PRODUCING THE NEW PHENOLIC RESIN, AND METHOD FOR PRODUCING THE NEW EPOXY RESIN

摘要

PROBLEM TO BE SOLVED: To realize both low dielectric constant and low dielectric dissipation factor suitable to current high-frequency type electronic parts-related materials without decreasing curability in curing reaction. SOLUTION: A phenolic resin is used as a curing agent for an epoxy resin or as a raw material for the epoxy resin. The phenolic resin has respective structural sites, i.e. phenolic hydroxy-containing aromatic hydrocarbon group(P) typical of phenolic structure, alkoxy-containing aromatic hydrocarbon group(B) typical of anisole structure and bivalent aralkyl group(X) and has in the molecular structure such a structure that the group(P) and the group(B) are bound to each other via the group(X). COPYRIGHT: (C)2006,JPO&NCIPI