发明名称 WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board where operability of a semiconductor element can be made sufficient by suppressing reflection loss of a high frequency signal which occurs from impedance discontinuity of a signal line in a developing part of a differential line, to be very small. <P>SOLUTION: In the wiring board, the differential line 8 formed of a pair of mutually parallel signal lines 8a and 8b is formed on an upper face of an insulating substrate 2. In the differential line 8, one end is set to be the developing part 8d where an interval between a pair of signal lines 8a and 8b gradually spreads, and thickness of the developing part 8d becomes thicker than that of a part except for the developing part 8d. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093324(A) 申请公布日期 2006.04.06
申请号 JP20040275519 申请日期 2004.09.22
申请人 KYOCERA CORP 发明人 KAWABATA KOKI
分类号 H01L23/12;H01P3/02;H01P5/02 主分类号 H01L23/12
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