| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing, which has excellent moldability, high reliability in actual application and considerably improved reliability in moisture resistance compared to conventional ones, and also to provide a semiconductor device with high reliability using the same. SOLUTION: The resin composition for sealing contains: (A) an epoxy resin containing the component represented by formula [I], (B) a curing agent for a phenol resin, (C) a cyclic compound represented by formula [II] and (D) an inorganic filler. The semiconductor device has a semiconductor chip sealed with the above cured product. In formula [I], R<SP>1</SP>is a monovalent or polyvalent alcohol residue and n is an integer of 2-15. In formula [II],αis a group selected from -S-, -O-, and -CH<SB>2</SB>-,βandγare independently hydrogen or an aryl group and m is an integer of 4-7. COPYRIGHT: (C)2006,JPO&NCIPI
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