发明名称 |
SEMICONDUCTOR COOLING SYSTEM AND PROCESS FOR MANUFACTURING THE SAME |
摘要 |
<p>A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.</p> |
申请公布号 |
WO2006016367(A2) |
申请公布日期 |
2006.02.16 |
申请号 |
WO2005IL00870 |
申请日期 |
2005.08.11 |
申请人 |
D.T.N.R. LTD.;ADAR, ELIEZER;GOTLIB, VLADIMIR |
发明人 |
ADAR, ELIEZER;GOTLIB, VLADIMIR |
分类号 |
H01L21/50;H01L23/34 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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