发明名称 SEMICONDUCTOR COOLING SYSTEM AND PROCESS FOR MANUFACTURING THE SAME
摘要 <p>A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.</p>
申请公布号 WO2006016367(A2) 申请公布日期 2006.02.16
申请号 WO2005IL00870 申请日期 2005.08.11
申请人 D.T.N.R. LTD.;ADAR, ELIEZER;GOTLIB, VLADIMIR 发明人 ADAR, ELIEZER;GOTLIB, VLADIMIR
分类号 H01L21/50;H01L23/34 主分类号 H01L21/50
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