| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching apparatus for a semiconductor wafer which can process wafers flat, and in addition can uniform the planarity of wafers in the same batch, and can carry out an etching process that can improve the so-called "nanotopography". SOLUTION: The etching apparatus 1 comprises an etching bath 2 and a wafer magazine 10 which is taken in and out of the etching bath 2 and stores a plurality of semiconductor wafers W within it. The etching apparatus etches the semiconductor wafers W by rotating them. To this end, the etching apparatus contains a normal rotation section X for normally rotating every other semiconductor wafer W among the plurality of them, to be rotated inside the wafer magazine 10 about its central axis; and a reverse rotation section Y for reversely rotating the semiconductor wafers W that is not rotated normally about their central axis. The rotary motion of the normal or reverse rotation X or Y is carried out by direct transmission of the rotary motion of the other section. COPYRIGHT: (C)2006,JPO&NCIPI
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