| 摘要 |
PROBLEM TO BE SOLVED: To abolish the possibility of dropping a sealing resin overflowing from a squeegee from the opening of a mask even at the stoppage time of printing by a lot replacement, a fault, etc. for a long time in an apparatus, and a method of manufacturing a TAB package to be resin sealed by printing, coating, curing of the sealing resin. SOLUTION: The method of manufacturing the TAB package includes steps of: forming a through hole 3 in a TAB tape made of an insulating resin having a lead 4 on one main surface; superposing and bonding the lead 4 extended into the through hole 3 and the corresponding electrode pad of a semiconductor chip 5; coating the sealing resin on the mask 8 having the opening 9 of the mask at the position corresponding to the through hole 3; coating the TAB tap with the sealing resin by a plurality of squeegees 10 moving on the mask 8; and then curing the sealing resin. In the method, the adjacent squeegees 10 are arranged alternately in the state that the ends of the adjacent squeegees 10 are superposed, and squeezing is performed while the positional relation is maintained as it is. COPYRIGHT: (C)2006,JPO&NCIPI
|
