| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of easily manufacturing a semiconductor mechanical quality sensor, in which its superstructure is located on a cantilever via space. <P>SOLUTION: In the sensor, while a polysilicon 119 is arranged at the bottom and the side of a cantilever 102, further a polysilicon 128 is formatively removed from surface of the cantilever 102, by using Low-Pressure Chemical Vapor Deposition (LPCVD) method or the like. After the top finishing of the polysilicon 128 is made, a Si<SB>3</SB>N<SB>4</SB>film 129, a n<SP>+</SP>polysilicon layer 130, and a BPSG film 131 as a surface protecting layer are formed to configure the superstructure. Then a window section 132 is opened, and from this window 132, both the polysilicon 119 and the polysilicon 128 are etched and removed by using tetramethylammonium hydroxide (TMAH) solution. Thus, the sensor with its superstructure (e.g., stopper) located on the cantilever via space is formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
